Hiring.Camp

Packaging Engineer (Substrate Design and Layout)

SanDisk

•

Yesterday

TAICHUNG CITY, TAIWAN, TaiwanFull-timeEngineeringEntry Level

Skills & Technologies

AutoCADCompliance

Ready to apply?

Opens SanDisk's career page

Apply Now
Back to jobs

Similar Jobs

6

Packaging Engineer (Substrate Design and Layout, Only open for fresh graduate)

SanDisk
Taichung, Taichung City, Taiwan

Substrate Packaging Research and Development Engineer

Intel
USA - AZ - Chandler, United States of America

Substrate Packaging Research and Development Engineer

Intel
USA - AZ - Chandler, United States of America

Packaging Engineer (Substrate Design and Layout)

SanDisk
Taichung, Taichung City, Taiwan

Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)

Intel
USA - AZ - Chandler, United States of America

Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)

Intel
USA - AZ - Chandler, United States of America