Hiring.Camp

Substrate Packaging Research and Development Engineer

Intel

Apr 27, 2026

USA - AZ - Chandler, United States of AmericaFull-timeEngineering$104k – $199k

Skills & Technologies

Compliance

Ready to apply?

Opens Intel's career page

Apply Now

Similar Jobs

1

Substrate Packaging Research and Development Engineer

USA - AZ - Chandler, United States of America