Process Engineer (Die bond)

Renesas Electronics

•

May 14, 2026

Telok Panglima Garang, MalaysiaFull-timeManufacturingAssociate

Skills & Technologies

Excel

Ready to apply?

Opens Renesas Electronics's career page

Apply Now

Back to jobs

Similar Jobs

Process Sustaining Engineer (Die Attach/DACA Engineering)

Nexperia

Seremban, Malaysia

Senior Staff Engineer Unit Process Development Die Attach

Infineon

Malacca, Malacca,MY, MY

Senior Engineer Unit Process Development Die Attach

Infineon

Malacca, Malacca,MY, MY

Staff Process Engineer - Die Attach / Clip Attach

onsemi

Lapu-Lapu City, Philippines, Philippines

Staff Engineer Unit Process Engineering-Die Bonding_5199

Infineon

Wuxi, Jiangsu,CN, CN

Manufacturing Engineer- Die Process

USA01 - USA Automotive

Dearborn, MI, United States, US

Manufacturing Engineer- Die Process

Ford

Dearborn, MI,US, US

R&D die-to-wafer Bonding Process Development Engineer

Imec

Leuven

Staff Engineer Unit Process Development Die Attach

Infineon

Malacca, Malacca,MY, MY

Engineer Unit Process Development Die Attach ( Contract )

Infineon

Malacca, Malacca,MY, MY

Principal Process Engineer, Die Bonding

Micron

Boise, ID - Main Site, United States of America

Principal Process Development Engineer (Die Attach Package R&D)

Nexperia

Seremban, Malaysia

Principal Process Engineer, Die Bonding

Micron Technology

Boise, ID,US, US

Process Development Engineer, Die Fabrication

Skorpios Technologies Inc

Temecula, CA +2 more

Process Engineer – Die to Wafer Hybrid Bonding (Silicon Photonics / CPO, R&D)

Applied Materials

Santa Clara,CA

Process Development Engineer, Die Fabrication

Skorpios Technologies Inc

Temecula, CA

Die Casting Process Engineer

Transparent Search Group

Waterloo

3rd Shift Die Inspection Process Support Engineer

RTX

US-MA-ANDOVER-AR1 ~ 358 Lowell St ~ AR1 DUKES BLDG, United States of America

4th Shift Die Inspection Process Support Engineer

RTX

US-MA-ANDOVER-AR1 ~ 358 Lowell St ~ AR1 DUKES BLDG, United States of America

Process Engineer (Die Engineer)

Michelinhr

Laem Chabang, Thailand

Process Engineer – Die to Wafer Hybrid Bonding

Amat

Santa Clara,CA, United States of America

Process Engineer - High Pressure Die Cast (HPDC)

Brunswick is

Mercury Plant 17 Fond Du Lac, United States of America

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Intel

MYS - Kulim, Malaysia

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Intel

MYS - Kulim, Malaysia

Senior FOL Process Engineer (Wire Bond & Die Attach)

Coherent

Ipoh, Malaysia, MY

Senior Die Cast Process Engineer

Default Brand

Minneapolis, MN

Associate Engineer - Process (Wire Bond & Die Attach)

Coherent

Ipoh, Malaysia, MY

Process Development Engineer IV (Staff) San Diego, CA

Esr Healthcare

San Diego