Hiring.Camp

Microelectronics Packaging Engineer (Level 3/4)

Northrop Grumman

May 19, 2026

Linthicum Heights, MD,US, USFull-timeEngineering$109k – $163k

Skills & Technologies

R.NETSalesforceWorkdayAutoCADSEOSEM

Ready to apply?

Opens Northrop Grumman's career page

Apply Now

Similar Jobs

4

Microelectronics Advanced Packaging Engineer

USA, OH, Beavercreek (3800 Pentagon Blvd), United States of America

Advanced Packaging Microelectronics Integration Engineer

200 NeoCity Wy, Kissimmee, FL 34744, USA

Microelectronics Advanced Packaging Engineer

USA, OH, Beavercreek (3800 Pentagon Blvd), United States of America

Senior Mechanical Engineer - Microelectronics Packaging (Onsite)

US-IA-CEDAR RAPIDS-121 ~ 350 Collins Rd NE ~ BLDG 121, United States of America