Module Development Engineer

Intel

•

Mar 26, 2026

USA - OR - Hillsboro, United States of AmericaFull-timeEngineering$134k – $255k

Skills & Technologies

SEMCompliance

Ready to apply?

Opens Intel's career page

Apply Now

Back to jobs

Similar Jobs

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America +4 more

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America +4 more

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America +2 more

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America +2 more

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Defect Inspection Engineer

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer (Adv Packaging)

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer (Adv Packaging)

Intel

USA - OR - Hillsboro, United States of America

Module Development Engineer - RF Test

Intel

USA - AZ - Chandler, United States of America

PIM (Si Gel Filled) Power Module Development Engineer

onsemi

Shenzhen, Guangdong, China, CN

Packaging Module Development Engineer

Intel

USA - AZ - Chandler, United States of America

Intel Foundry Module Development Engineer

Intel

USA - OR - Hillsboro, United States of America

Staff Package Design Engineer- experienced in package development of power SiP/module

Renesas Electronics

Zhubei, Taiwan

Packaging Module Development Engineer

Intel

USA - AZ - Chandler, United States of America

Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)

Intel

USA - AZ - Chandler, United States of America

Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)

Intel

USA - AZ - Chandler, United States of America

Direct Lid/Stiffener Attach Packaging Module Development Engineer

Intel

MYS - Kulim, Malaysia