Package Development Engineer

Catania, Italy

Staff Package Design Engineer- experienced in package development of power SiP/module

Renesas Electronics

Zhubei, Taiwan

Package Development, Signal Integrity and Power Integrity Staff to Senior Staff Engineer

Marvell

IN - Bangalore, India

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron

MSB, Singapore

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Staff Engineer Package Process Development-Wire Bond_2769

Wuxi, Jiangsu,CN, CN

Sr. Staff Engineer Package Process Development DSC

Wuxi, Jiangsu,CN, CN

Staff Engineer Package Process Development-DB_2757

Wuxi, Jiangsu,CN, CN

Sr. Staff Engineer Package Process Development SON

Wuxi, Jiangsu,CN, CN

Staff Engineer Package Development-Soldering_2725

Wuxi, Jiangsu,CN, CN

Staff Engineer Package Process Development-Material_4027

Wuxi, Jiangsu,CN, CN

Sr. Staff Engineer Package Process Development DSO

Wuxi, Jiangsu,CN, CN

Staff Engineer Package Development-Trim&Form_2644

Wuxi, Jiangsu,CN, CN

SiC Wafer and Package Technology Development Engineer

Scottsdale, AZ, United States, US

Staff Engineer Package Development Sawing

Wuxi, Jiangsu,CN, CN

Package Development, Signal Integrity and Power Integrity Engineer, Senior Staff

Marvell

US-TX - Austin, United States of America

Process Development Engineer (Wire bond Package R&D)

Seremban, Malaysia

Staff Package Design Engineer- experienced in package development of power SiP/module

Renesas Electronics

Zhubei, Taiwan

SiC Wafer & Package Technology Development Engineer

Munich, Bayern, Germany, DE

Engr Prin, Package Development (NPI Mold Engineer)

Seremban, Negeri Sembilan, Malaysia, MY

Engr Sr, Package Development (NPI Singulation Engineer)

Seremban, Negeri Sembilan, Malaysia, MY

Sr. Principal Engineer – GaN Package Development (m/f/d)

Munich, Germany

Principal Process Development Engineer (Die Attach Package R&D)

Seremban, Malaysia

Package Development Engineer (temporary assignment)

Imec

Leuven

IC Package Development Engineer (Germany)

Imec

Heilbronn

Principal Engineer Advanced Package Technology Development

Boise, Idaho, United States of America

Principal Engineer Advanced Package Technology Development

Singapore, Singapore

Package Development Engineering – Product Integration Engineer (PDE PIE)